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COB(Chip On Board) 工艺技术

时间:2014-07-02 23:16:30      阅读:752      评论:0      收藏:0      [点我收藏+]

COX(Chip On X)

•X 基板:
 PCB (Printed circuit board)
 FPC (Flexible Printed Circuit)
 Glass
•导线焊接
球形焊接(金线)
楔形焊接(铝线或金线)
•晶片(Die):硅晶片IC&LSI,砷化镓,……
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COB(Chip On Board) 工艺技术,布布扣,bubuko.com

COB(Chip On Board) 工艺技术

原文:http://www.cnblogs.com/heiyue/p/3818746.html

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