TF file

To software:Design rules for placement and routing

　　　　　　interconnect resistance /capacitance data for generate RC valuse and wireload models for design

　　　　　　process information for metal interconnect layers:include metal thickness/metal resistance/line-to-line capacitance values of metal layers,for determining coupling capacitance

Using LEF to create Technology Information

Using OpenAccess to create Technology Information

TF file

原文：https://www.cnblogs.com/lelin/p/11992713.html