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Not Recommended(不建議) |
Recommended(建議) |
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通孔的焊墊必須用Cover film 覆蓋住,以避免使用時剝落。 |
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| 2. |
Circuit Pattern Guidance |
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Not Recommended(不建議) |
Recommended(建議) |
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Avoid sudden expansion or reduction in pattern width. No sharp angle. |
避免在線路的寬度上突然的變大或是變小,而起不應該有尖角出現。 |
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| 3. |
Design at Folding Area |
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Not Recommended(不建議) |
Recommended(建議) |
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If the FPC need to be folded then the folding area shall be covered with cover film to prevent trace breaking. |
如果軟板有彎折的需要時,建議Cover Film必須覆蓋過彎折處,以避免線路折斷。 |
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Avoid folding at below locations a. The change of pattern width. b. Folding parallel to the pattern. |
避免以下的彎折及方法: a.線路寬度改變的地方。 b.平行線路彎折。 |
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| 4. |
Plating Leads |
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Not Recommended(不建議) |
Recommended(建議) |
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Plating leads and disconnection holes should be designed as illustrated in order to avoid short circuits. |
相鄰線路應該盡可能用最大角度展開以避免短路。 |
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| 5. |
Connector Terminal |
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